Solution cluster
Heat-spreading plates
Conductive layers that redistribute hot spots across thermal assemblies.
Why it matters
This approach appears across patents that solve related technical constraints through a common strategy family.
Patents in current set
6
Domain
Thermal systems
Patents in this approach
Flip chip package with heat spreader allowing multiple heat sink attachment
US6829144 • IBM [US]
chip package is provided with multiple ways of attaching a heat sink directly to the chip carrier.
Heat-assisted recording head with one or more surface-plasmonic plates operable as a near-field transducer
US11056135 • SEAGATE TECHNOLOGY LLC [US]
recording head includes a dielectric waveguide that extends towards a media-facing surface of the recording head.
Antenna apparatus and electronic timepiece
US12573762 • CASIO COMPUTER CO., LTD.
antenna apparatus includes, a ring-shaped antenna element positioned on a first plane; a grounding conductive plate positioned on a second plane parallel to the antenna element; a conductive member that is positioned on a side farther from a center position of the first plane enclosed by an outer periphery of the antenna element; and a power supply terminal.
Sound producing device
US12574685 • GOERTEK INC.
sound producing device, including a magnetic circuit system and a vibration system.
Heat spreader with excess solder basin
US6191946 • THERMAL CORP [US]
The apparatus is a heat spreader for attachment to a device to be cooled, with heat pipes attached within holes in the heat spreader.
Electronic device comprising antenna
US12573748 • SAMSUNG ELECTRONICS CO., LTD.
electronic device according to an embodiment comprises: a printed circuit board; a first electronic component electrically connected to the printed circuit board; a second electronic component electrically connected to the printed circuit board and facing one side surface of the first electronic component; a first conductive plate including a feeding point supporting the first electronic component and electrically connected to the printed circuit board; a second conductive plate spaced apart from the first conductive plate and supporting the second electronic component; and a plurality of bridges connecting the first conductive plate with the second conductive plate to form a slot, wherein a wireless communication circuit may be configured to communicate with an external electronic device through at least one frequency band using the first conductive plate and the second conductive plate.