US12575396USUSPTO Grant XML

Electronic device including a conductive pad and a floating pad with a metal frame outlining an observation region

An electronic device is provided. The electronic device includes a substrate, a first conductive pad and a floating pad. The first conductive pad is disposed on the substrate. The floating pad is disposed on the substrate and adjacent to the first conductive pad. The floating pad includes a metal frame, and an inner edge of the metal frame defines an outline of an observation region. In addition, in a bottom-view diagram of the electronic device, the outline of the observation region has at least one arc-shaped edge.

Patent

Brief

Patent brief

Problem

How can corrosion in underground pipelines and conduits be prevented?

Novelty

The electronic device includes a substrate, a first conductive pad and a floating pad.

Uses

Retrofit pipe, Transport pipe, Chemical lines

Assignee

INNOLUX CORPORATION

Published

Mar 10, 2026

Inventors

Yu-Chia Huang, Mei-Chi Hsu, Chung-Wen Yen

Domain

Infrastructure / energy

Plain-English summary

Problem

How can corrosion in underground pipelines and conduits be prevented?

Solution

electronic device is provided.

Key novelty

The electronic device includes a substrate, a first conductive pad and a floating pad.

Applications

Retrofit pipeTransport pipeChemical linesEnclosure cooling

Relevant search intents

liningduct

Claims preview

1 . An electronic device, comprising: a substrate; a first conductive pad disposed on the substrate; and a floating pad disposed on the substrate and adjacent to the first conductive pad, wherein the floating pad comprises a metal frame, wherein an inner edge of the metal frame defines an outline of an observation region; a first transparent conductive pad disposed on the floating pad, and the first transparent conductive pad comprises a first portion disposed on the metal frame and a second portion disposed on the observation region; an electronic component disposed on the floating pad; and a conductive particle disposed between the second portion of the first transparent conductive pad and the electronic component, wherein in a bottom-view diagram of the electronic device, the outline of the observation region has at least one arc-shaped edge, wherein in a normal direction of the substrate, a distance between a surface of the first portion and a surface of the second portion is represented by H1, a height of the conductive particle is represented by H2, and H1 and H2 satisfy the following relationship: H 1 0.5 H 2. 2 . The electronic device as claimed in claim 1 , wherein the conductive particle is disposed under the electronic component and overlapping with the observation region, wherein in the bottom-view diagram of the electronic device, an area of the observation region is represented by A1, an area of the conductive particle is represented by A2, and A1 and A2 satisfy the following relationship: A 1 A 2. 3 . The electronic device as claimed in claim 2 , wherein A1 and A2 satisfy the following relationship: A 1 2 A 2.

Linked approaches

Polymer liners

Internal pipe linings that block direct chemical attack.

Directed airflow

Air-channeling systems that improve cooling efficiency in enclosed devices.

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